DM3730CUS100

Product Summary

The DM3730CUS100 high-performance, applications processor is based on the enhanced device architecture and are integrated on TI advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This DM3730CUS100 Applications Processor data manual presents the electrical and mechanical specifications for the DM3730CUS100 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730CUS100 Applications Processor unless otherwise indicated.

Parametrics

DM3730CUS100 absolute maximum ratings: (1)Supply voltage range for MPU / IVA domain: -0.5 to 1.5 V; (2)vdd_core Supply voltage range for core domain: -0.5 to 1.5 V; (3)vdda_wkup_bg_bb Supply voltage range for wake-up domain (internal LDO): -0.5 to 2.6 V; (4)vdda_dplls_dll Supply voltage for MPU, IVA, Core DPLLs, and DLL: -0.5 to 2.1 V; (5)vdda_dpll_per Supply voltage for DPLLs (peripherals): -0.5 to 2.1 V; (6)vdds_sram Supply voltage for SRAM LDOs: -0.5 to 2.6 V; (7)vdda_dac Supply voltage for video buffers and DAC: -0.5 to 2.10 V; (8)vdds Supply voltage for 1.8-V I/O macros: -0.5 to 2.45 V; (9)vdds_mem Supply voltage for memory buffers: -0.5 to 2.45 V; (10)vdds_mmc1 Supply voltage range for mmc1 1.8-V mode: -0.5 to 2.45 V; (11)dual voltage IOs 3.0-V mode: -0.5 to 3.80V; (12)vdds_x Supply voltage range for dual 1.8-V mode: -0.5 to 3.80 V; (13)voltage GPIOs 3.0-V mode: -0.5 to 3.80; (14)VPAD mmc1 1.8-V mode: -0.5 to 2.45 V; (15)3.0-V mode: -0.5 to 3.80; (16)Video DAC: -0.5 to 2.10 V; (17)The other balls: -0.5 to 2.45 V; (18)Iclamp Clamp current for an input or output: -20 to 20 mA; (19)TSTG(4) Storage temperature range: -65 to 150 ℃.

Features

DM3730CUS100 features: (1)Compatible with OMAP 3 Architecture; (2)MPU Subsystem; (3)High Performance Image, Video, Audio Accelerator Subsystem; (4)POWERVR SGX Graphics Accelerator; (5)Advanced Very-Long-Instruction-Word; (6)External Memory Interfaces; (7)Comprehensive Power, Reset, and Clock; (8)ARM CortexTM-A8 Core; (9)12 32-bit General Purpose Timers; (10)45-nm CMOS Technology.

Diagrams