Product Summary

The XC3S250E-4FTG256C is an FPGA. It is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The XC3S250E-4FTG256C offers densities ranging from 100,000 to 1.6 million system gates. The XC3S250E-4FTG256C is combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.

Parametrics

XC3S250E-4FTG256C absolute maximum ratings: (1)Internal supply voltage:–0.5V to 1.32V; (2)Auxiliary supply voltage:–0.5V to 3.00V; (3)Output driver supply voltage:–0.5V to 3.75V; (4)Input reference voltage:–0.5V to VCCO+0.5V ; (5)Junction temperature:125℃; (6)Storage temperature:–65℃ to 150℃.

Features

XC3S250E-4FTG256C features: (1)Very low cost, high-performance logic solution for high-volume, consumer-oriented applications; (2)Proven advanced 90-nanometer process technology; (3)Multi-voltage, multi-standard SelectIO interface pins; (4)Densities up to 33,192 logic cells, including optional shift register or distributed RAM support; (5)Efficient wide multiplexers, wide logic; (6)Fast look-ahead carry logic; (7)Enhanced 18 x 18 multipliers with optional pipeline; (8)IEEE 1149.1/1532 JTAG programming/debug port; (9)Clock skew elimination (delay locked loop); (10)Frequency synthesis, multiplication, division; (11)High-resolution phase shifting; (12)Wide frequency range (5 MHz to over 300 MHz); (13)Low-cost, space-saving SPI serial Flash PROM; (14)x8 or x8/x16 parallel NOR Flash PROM; (15)Low-cost Xilinx Platform Flash with JTAG.

Diagrams

XC3S250E-4FTG256C block diagram

Image Part No Mfg Description Data Sheet Download Pricing
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XC3S250E-4FTG256C
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